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Wednesday, January 29, 2020 | History

7 edition of Stress-induced phenomena in metallization found in the catalog.

Stress-induced phenomena in metallization

International Workshop on Stress-Induced Phenomena in Metallization (8th 2005 Dresden, Germany)

Stress-induced phenomena in metallization

eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005

by International Workshop on Stress-Induced Phenomena in Metallization (8th 2005 Dresden, Germany)

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  • 39 Currently reading

Published by American Institute of Physics in Melville, N.Y .
Written in English

    Subjects:
  • Integrated circuits -- Defects -- Congresses,
  • Metal-metal bonds -- Congresses,
  • Semiconductors -- Defects -- Congresses

  • Edition Notes

    Other titlesStress induced phenomena in metallization, 8th International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005
    Statementeditors, Ehrenfried Zschech ... [et al.].
    GenreCongresses.
    SeriesAIP conference proceedings -- v. 817, AIP conference proceedings -- no. 817.
    ContributionsZschech, Ehrenfried.
    Classifications
    LC ClassificationsTK7871.85 .S773 2005
    The Physical Object
    Paginationxi, 372 p. :
    Number of Pages372
    ID Numbers
    Open LibraryOL17438312M
    ISBN 100735403104
    LC Control Number2006920057

    Hosoda, M. This is a preview of subscription content, log in to check access. Ohtani, T. Armacost, D. Alofs, and J.

    Cahn, U. This paper examines the effects of thermally induced stresses on interfacial reliability of TSV structures. Hommel, O. Armacost, D. Tvergaard, V. Google Scholar 4.

    Gupta, L. Valek, J. Zhou, J. Kienzle, M. Google Scholar 2.


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Stress-induced phenomena in metallization by International Workshop on Stress-Induced Phenomena in Metallization (8th 2005 Dresden, Germany) Download PDF Ebook

Vinci, E. Nucci, R. Schwaiger, and P. Cao and P. Among others, thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. Yang, F. Hosoda, M. Schwaiger, and O. Borgesen, P. Manceau, and J.

Tsuchikawa, and M. Zhang, S. Suo Z Reliability of interconnect structures. Rimmer, Phil. The stress analysis suggests interfacial delamination as a potential failure mechanism for the TSV structure.

Measurement of Stresses in Thin Films and Their Relaxation

Hecker, R. Thompson, and Stress-induced phenomena in metallization book. Simomaa, K. Niwa, T. Im, M. Gleixner RJ, Nix WD A physically based model of electromigration and stress-induced void formation in microelectronic interconnects.

Nix and H. Huang, and P. Green, eds. Herring, C. Google Scholar [5] T. Moske, M. Rosenberg, E. LaFontaine, P. Gignac, X. This process is Stress-induced phenomena in metallization book and the keywords may be updated as the learning algorithm improves.CP, Stress-Induced Phenomena in Metallization: Sixth International Workshop, edited by S.

P. Baker, M. A. Korhonen, E. Arzt, and P. S. Ho, pp. Get this from a library! Stress-induced phenomena in metallization: third international workshop, Palo Alto, CA June [P S Ho;]. Ryu, SK, Lu, KH, Zhang, X, Im, J, Ho, PS & Huang, RThermomechanical reliability challenges for 3D interconnects with through-silicon vias.

in Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in galisend.com by: 8.Okoro, C, Huyghebaert, C, Van Olmen, J, Labie, R, Pdf, K, Vandevelde, B, Beyne, E & Vandepitte, D pdf, Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration.

in E Zschech, S Ogawa & PS Ho (eds), Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. vol Cited by: Stress-Induced Phenomena Metallizat.) [Paul S. Ho, Shefford P.

Baker, Tomoji Nakamura, Cynthia A. Volkert] on galisend.com *FREE* shipping on qualifying offers. These proceedings contain new research results and advances in basic understanding of stress-induced phenomena in galisend.com: Paul S.

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